Part Details | PLUG-IN ELECTRONIC COMPONENTS SOCKET
5935-00-811-7190 An item designed to electrically connect and mechanically position the base of an item having plug-in-type contacts, and to facilitate replacement of the item accommodated. It includes sockets which accommodate the contacts of capacitors, coils, crystals, electron tubes, relays, semiconductor devices and vibrators. Excludes sockets or receptacles designed to accommodate plug-in component circuit boards (printed circuit boards) and electronic modules or sub-assemblies. Also excludes heat-dissipating (not heat-sinks) sockets for mounting "power transistors".
Alternate Parts: A2238, 8060F193, 80601G3, 8060-1G3, 5935-00-811-7190, 00-811-7190, 5935008117190, 008117190
| Supply Group (FSG) | NSN Assigned | NIIN | Item Name Code (INC) |
|---|---|---|---|
| 59 | APR 01, 1968 | 00-811-7190 | 28914 ( SOCKET, PLUG-IN ELECTRONIC COMPONENTS ) |
REFERENCE DRAWINGS & PICTURES
TOP MOUNT, PRESS FIT
ROUND, BODY
CIRCULAR IRREGULAR 0.100 INCH
Cross Reference | NSN 5935-00-811-7190
| Part Number | Cage Code | Manufacturer |
|---|---|---|
| A2238 | 81535 | AERONAUTICAL COMMUNICATIONSEQUIPMENT INC |
| 8060F193 | 91506 | AUGAT INC |
| 8060-1G3 | 91506 | AUGAT INC |
Technical Data | NSN 5935-00-811-7190
| Characteristic | Specifications |
|---|---|
| CONTACT POSITION ARRANGEMENT STYLE | CIRCULAR IRREGULAR 0.100 INCH |
| ACCOMMODATED CONTACT QUANTITY | 3 |
| CONTACT MATERIAL | BERYLLIUM COPPER |
| CONTACT SURFACE TREATMENT | U0000 ANY ACCEPTABLE AND NICKEL |
| BODY STYLE | TOP MOUNT, PRESS FIT |
| TERMINAL LENGTH | 0.109 INCHES MINIMUM |
| OVERALL HEIGHT | 0.304 INCHES NOMINAL |
| OVERALL DIAMETER | 0.256 INCHES MAXIMUM |
| BODY MATERIAL | PLASTIC |
| TERMINAL TYPE AND QUANTITY | 3 WIRE LEAD |
| MOUNTING TYPE FOR WHICH DESIGNED | CHASSIS |
| MOUNTING METHOD | PRESS FIT |
| MOUNTING HOLE STYLE | ROUND, BODY |
| BODY MOUNTING HOLE ACCOMMODATION DIAMETER | 0.220 INCHES MINIMUM AND 0.222 INCHES MAXIMUM |
| POLARIZATION TYPE | COLORED DOT |
| SPECIFIC EQUIPMENT ACCOMMODATED | SEMICONDUCTOR DEVICE |
| FABRICATION METHOD | MOLDED |
| PRECIOUS MATERIAL | GOLD |
| PRECIOUS MATERIAL AND WEIGHT | 0.015 GOLD GRAINS, TROY |
| PRECIOUS MATERIAL AND LOCATION | CONTACT SURFACES GOLD |