NSN 5935-00-835-8783

Part Details | PLUG-IN ELECTRONIC COMPONENTS SOCKET

5935-00-835-8783 An item designed to electrically connect and mechanically position the base of an item having plug-in-type contacts, and to facilitate replacement of the item accommodated. It includes sockets which accommodate the contacts of capacitors, coils, crystals, electron tubes, relays, semiconductor devices and vibrators. Excludes sockets or receptacles designed to accommodate plug-in component circuit boards (printed circuit boards) and electronic modules or sub-assemblies. Also excludes heat-dissipating (not heat-sinks) sockets for mounting "power transistors".

Alternate Parts: 20892720702, 2089272-0702, 20892720702, 2089272-0702, 1842, 18-42, 5935-00-835-8783, 00-835-8783, 5935008358783, 008358783

Supply Group (FSG) NSN Assigned NIIN Item Name Code (INC)
59DEC 07, 196600-835-878328914 ( SOCKET, PLUG-IN ELECTRONIC COMPONENTS )
REFERENCE DRAWINGS & PICTURES

TOP MOUNT, PRESS FIT

ROUND, FLATTED

RECTANGULAR

Cross Reference | NSN 5935-00-835-8783
Part Number Cage Code Manufacturer
2089272-070227914HONEYWELL INTERNATIONAL INCDBA HONEYWELL
2089272-070206845RAYTHEON COMPANYDBA RAYTHEON
18-4206776ROBINSON NUGENT INC
Technical Data | NSN 5935-00-835-8783
Characteristic Specifications
CONTACT POSITION ARRANGEMENT STYLE RECTANGULAR
ACCOMMODATED CONTACT QUANTITY4
CONTACT MATERIAL BERYLLIUM COPPER
CONTACT SURFACE TREATMENTU0000 ANY ACCEPTABLE AND G0000 ANY ACCEPTABLE
BODY STYLE TOP MOUNT, PRESS FIT
TERMINAL LENGTH0.118 INCHES NOMINAL
OVERALL HEIGHT0.430 INCHES NOMINAL
OVERALL DIAMETER0.312 INCHES NOMINAL
PROJECTION LENGTH ABOVE MOUNTING SURFACE0.062 INCHES NOMINAL
BODY MATERIAL PLASTIC
TERMINAL TYPE AND QUANTITY4 SOLDER STUD
MOUNTING TYPE FOR WHICH DESIGNED CHASSIS
MOUNTING METHOD PRESS FIT
MOUNTING HOLE STYLE ROUND, FLATTED
BODY MOUNTING HOLE ACCOMMODATION DIAMETER0.252 INCHES NOMINAL
DISTANCE FROM FLATTED PORTION TO OPPOSITE SURFACE0.232 INCHES NOMINAL
POLARIZATION TYPE OFF CENTER HOLE
FEATURES PROVIDED COMPONENT RETAINING DEVICE
SPECIFIC EQUIPMENT ACCOMMODATEDSEMICONDUCTOR DEVICE
FABRICATION METHOD MOLDED
TEMP RATING225.0 DEG CELSIUS
PRECIOUS MATERIAL GOLD AND SILVER
PRECIOUS MATERIAL AND WEIGHT0.020 GOLD GRAINS, TROY AND 0.020 SILVER GRAINS, TROY
PRECIOUS MATERIAL AND LOCATIONCONTACT SURFACES GOLD AND CONTACT SURFACES SILVER