NSN 5935-00-887-4121

Part Details | PLUG-IN ELECTRONIC COMPONENTS SOCKET

5935-00-887-4121 An item designed to electrically connect and mechanically position the base of an item having plug-in-type contacts, and to facilitate replacement of the item accommodated. It includes sockets which accommodate the contacts of capacitors, coils, crystals, electron tubes, relays, semiconductor devices and vibrators. Excludes sockets or receptacles designed to accommodate plug-in component circuit boards (printed circuit boards) and electronic modules or sub-assemblies. Also excludes heat-dissipating (not heat-sinks) sockets for mounting "power transistors".

Alternate Parts: 14M22831, 24133689, 241-33689, 24133689, 241-33689, 5935-00-887-4121, 00-887-4121, 5935008874121, 008874121

Supply Group (FSG) NSN Assigned NIIN Item Name Code (INC)
59JAN 01, 196200-887-412128914 ( SOCKET, PLUG-IN ELECTRONIC COMPONENTS )
REFERENCE DRAWINGS & PICTURES

BOTTOM SURFACE MOUNT

RECTANGULAR, W/ROUNDED ENDS AND TWO MOUN TING HOLES/SLOTS

IN LINE

Cross Reference | NSN 5935-00-887-4121
Part Number Cage Code Manufacturer
14M2283171785CINCH CONNECTORS, INC.
241-3368964294DANFOSS FLUID POWER INCRACINE OPN
241-3368924976DANFOSS INC
Technical Data | NSN 5935-00-887-4121
Characteristic Specifications
CONTACT POSITION ARRANGEMENT STYLE IN LINE
ACCOMMODATED CONTACT QUANTITY2
CONTACT MATERIAL COPPER ALLOY
CONTACT SURFACE TREATMENT ANY ACCEPTABLE
BODY STYLE BOTTOM SURFACE MOUNT
OVERALL LENGTH1.719 INCHES NOMINAL
OVERALL HEIGHT0.422 INCHES NOMINAL
OVERALL WIDTH0.500 INCHES NOMINAL
PROJECTION LENGTH ABOVE MOUNTING SURFACE0.047 INCHES NOMINAL
BODY MATERIAL PLASTIC
TERMINAL TYPE AND QUANTITY2 TAB, SOLDER LUG
MOUNTING TYPE FOR WHICH DESIGNED CHASSIS
MOUNTING METHOD BODY THROUGH HOLE
MOUNTING HOLE STYLE RECTANGULAR, W/ROUNDED ENDS AND TWO MOUN TING HOLES/SLOTS
MOUNTING HOLE DIAMETER0.136 INCHES NOMINAL
BODY MOUNTING HOLE ACCOMMODATION WIDTH0.500 INCHES NOMINAL
CENTER TO CENTER DISTANCE BETWEEN OUTSIDE MOUNTING HOLES ALONG LENGTH1.375 INCHES NOMINAL
POLARIZATION TYPE CONTACT SIZE
SPECIFIC EQUIPMENT ACCOMMODATEDSEMICONDUCTOR DEVICE
FABRICATION METHOD LAMINATED