NSN 5961-01-007-6843

Part Details | UNITIZED SEMICONDUCTOR DEVICES

5961-01-007-6843 Two or more discrete semiconductor devices such as diode(s) and/or transistor(s), permanently cased, encapsulated, or potted together to form an inseparable unit. Excludes devices having one or more components other than semiconductor devices. The individually distinct devices forming the unit may be internally connected. The unit in itself does not perform a complete specific function and cannot be assigned a more definite item name. It may include or consist of inseparable matched pairs. May or may not include mounting hardware and/or heatsink. For interconnected items arranged in stack(s), see RECTIFIER, SEMICONDUCTOR DEVICE. For items formed on or within a semiconductor material substrate, formed on an insulating substrate or formed on a combination of both of these types, see MICROCIRCUIT (as modified). Excludes NETWORK (as modified); ABSORBER, OVERVOLTAGE; SEMICONDUCTOR DEVICE SET; and SEMICONDUCTOR DEVICE ASSEMBLY. Do not use if more specific name applies.

Alternate Parts: UDZ860, 3533310010, 353-3310-010, 3533310010, 353-3310-010, 5961-01-007-6843, 01-007-6843, 5961010076843, 010076843

Supply Group (FSG) NSN Assigned NIIN Item Name Code (INC)
59AUG 09, 197501-007-684361962 ( SEMICONDUCTOR DEVICES, UNITIZED )
REFERENCE DRAWINGS & PICTURES
Cross Reference | NSN 5961-01-007-6843
Part Number Cage Code Manufacturer
UDZ86012969MICRO USPD INC
353-3310-01013499ROCKWELL COLLINS, INC.DBA GOVERNMENT SYSTEMS
353-3310-01095105ROCKWELL COLLINS, INC.DIV GOVERNMENT SYSTEMS - DALLAS
Technical Data | NSN 5961-01-007-6843
Characteristic Specifications
COMPONENT NAME AND QUANTITY2 SEMICONDUCTOR DEVICE DIODE
MAXIMUM OPERATING TEMP PER MEASUREMENT POINT175.0 DEG CELSIUS AMBIENT AIR
INCLOSURE MATERIAL GLASS
MOUNTING METHOD TERMINAL
TERMINAL LENGTH0.700 INCHES MINIMUM
TERMINAL TYPE AND QUANTITY2 UNINSULATED WIRE LEAD
OVERALL LENGTH0.450 INCHES MAXIMUM
OVERALL DIAMETER0.085 INCHES MAXIMUM
FUNCTION FOR WHICH DESIGNED BIDIRECTIONAL AND ZENER DIODE
FEATURES PROVIDED HERMETICALLY SEALED CASE
SPECIAL FEATURESALL SEMICONDUCTOR DEVICE DIODE JUNCTION PATTERN ARRANGEMENT: PN