Part Details | DIODE SEMICONDUCTOR DEVICE
5961-01-014-8152 A two electrode semiconductor device having an asymmetrical voltage - current characteristic. May or may not include mounting hardware and/or heatsink. Excludes LIGHT EMITTING DIODE and SEMICONDUCTOR DEVICE,PHOTO. For items containing material such as selenium and copper oxide, see RECIFIER, METALLIC.
Alternate Parts: 50822437, 5082-2437, HP50822437, HP5082-2437, 50822437, 5082-2437, HP50822437, HP5082-2437, 247ASC1235002, 247ASC1235-002, 5961-01-014-8152, 01-014-8152, 5961010148152, 010148152
| Supply Group (FSG) | NSN Assigned | NIIN | Item Name Code (INC) |
|---|---|---|---|
| 59 | JAN 06, 1976 | 01-014-8152 | 20589 ( SEMICONDUCTOR DEVICE, DIODE ) |
REFERENCE DRAWINGS & PICTURES
Cross Reference | NSN 5961-01-014-8152
| Part Number | Cage Code | Manufacturer |
|---|---|---|
| 5082-2437 | 50434 | AVAGO TECHNOLOGIES U.S. INC.DBA AVAGO TECHNOLOGIES |
| HP5082-2437 | 50434 | AVAGO TECHNOLOGIES U.S. INC.DBA AVAGO TECHNOLOGIES |
| 5082-2437 | 28480 | HEWLETT-PACKARD COMPANYDBA HP |
| HP5082-2437 | 28480 | HEWLETT-PACKARD COMPANYDBA HP |
| 247ASC1235-002 | 30003 | NAVAL AIR SYSTEMS COMMAND MANAGEDORIGINAL DESIGN ACTIVITY NOT |
Technical Data | NSN 5961-01-014-8152
| Characteristic | Specifications |
|---|---|
| SEMICONDUCTOR MATERIAL | SILICON |
| INCLOSURE MATERIAL | GLASS AND METAL |
| MOUNTING METHOD | TERMINAL |
| TERMINAL TYPE AND QUANTITY | 2 UNINSULATED WIRE LEAD |
| FEATURES PROVIDED | HERMETICALLY SEALED CASE |