NSN 5961-01-015-2177

Part Details | UNITIZED SEMICONDUCTOR DEVICES

5961-01-015-2177 Two or more discrete semiconductor devices such as diode(s) and/or transistor(s), permanently cased, encapsulated, or potted together to form an inseparable unit. Excludes devices having one or more components other than semiconductor devices. The individually distinct devices forming the unit may be internally connected. The unit in itself does not perform a complete specific function and cannot be assigned a more definite item name. It may include or consist of inseparable matched pairs. May or may not include mounting hardware and/or heatsink. For interconnected items arranged in stack(s), see RECTIFIER, SEMICONDUCTOR DEVICE. For items formed on or within a semiconductor material substrate, formed on an insulating substrate or formed on a combination of both of these types, see MICROCIRCUIT (as modified). Excludes NETWORK (as modified); ABSORBER, OVERVOLTAGE; SEMICONDUCTOR DEVICE SET; and SEMICONDUCTOR DEVICE ASSEMBLY. Do not use if more specific name applies.

Alternate Parts: SPQ526K, MHQ6001, 18580008, 1858-0008, 5961-01-015-2177, 01-015-2177, 5961010152177, 010152177

Supply Group (FSG) NSN Assigned NIIN Item Name Code (INC)
59JAN 16, 197601-015-217761962 ( SEMICONDUCTOR DEVICES, UNITIZED )
REFERENCE DRAWINGS & PICTURES
Cross Reference | NSN 5961-01-015-2177
Part Number Cage Code Manufacturer
SPQ526K04713FREESCALE SEMICONDUCTOR, INC.
MHQ600104713FREESCALE SEMICONDUCTOR, INC.
1858-000828480HEWLETT-PACKARD COMPANYDBA HP
Technical Data | NSN 5961-01-015-2177
Characteristic Specifications
COMPONENT NAME AND QUANTITY4 TRANSISTOR
MAXIMUM OPERATING TEMP PER MEASUREMENT POINT200.0 DEG CELSIUS AMBIENT AIR
INCLOSURE MATERIAL CERAMIC
MOUNTING METHOD PRESS FIT
TERMINAL TYPE AND QUANTITY14 RIBBON
OVERALL LENGTH0.785 INCHES MAXIMUM
OVERALL HEIGHT0.170 INCHES MAXIMUM
OVERALL WIDTH0.280 INCHES MAXIMUM