NSN 5961-01-020-1607

Part Details | UNITIZED SEMICONDUCTOR DEVICES

5961-01-020-1607 Two or more discrete semiconductor devices such as diode(s) and/or transistor(s), permanently cased, encapsulated, or potted together to form an inseparable unit. Excludes devices having one or more components other than semiconductor devices. The individually distinct devices forming the unit may be internally connected. The unit in itself does not perform a complete specific function and cannot be assigned a more definite item name. It may include or consist of inseparable matched pairs. May or may not include mounting hardware and/or heatsink. For interconnected items arranged in stack(s), see RECTIFIER, SEMICONDUCTOR DEVICE. For items formed on or within a semiconductor material substrate, formed on an insulating substrate or formed on a combination of both of these types, see MICROCIRCUIT (as modified). Excludes NETWORK (as modified); ABSORBER, OVERVOLTAGE; SEMICONDUCTOR DEVICE SET; and SEMICONDUCTOR DEVICE ASSEMBLY. Do not use if more specific name applies.

Alternate Parts: HDGP1001, 528132000, 5281-32000, 528057, 528-057, 3N161, HDGP1001, HDGP1001, 5961-01-020-1607, 01-020-1607, 5961010201607, 010201607

Supply Group (FSG) NSN Assigned NIIN Item Name Code (INC)
59APR 25, 197601-020-160761962 ( SEMICONDUCTOR DEVICES, UNITIZED )
REFERENCE DRAWINGS & PICTURES
Cross Reference | NSN 5961-01-020-1607
Part Number Cage Code Manufacturer
HDGP10018V613BOEING COMPANY, THEDBA BOEING
5281-3200004901BOONTON ELECTRONICS CORPORATIONDIV BOONTON ELECTRONICS
528-05704901BOONTON ELECTRONICS CORPORATIONDIV BOONTON ELECTRONICS
3N16104901BOONTON ELECTRONICS CORPORATIONDIV BOONTON ELECTRONICS
HDGP100173293L-3 COMMUNICATIONS ELECTRONTECHNOLOGIES, INC.
HDGP100102731MCDONNELL DOUGLAS HELICOPTER CO INC
Technical Data | NSN 5961-01-020-1607
Characteristic Specifications
TERMINAL TYPE AND QUANTITY4 UNINSULATED WIRE LEAD
OVERALL DIAMETER0.230 INCHES MAXIMUM