NSN 5961-01-030-3308

Part Details | UNITIZED SEMICONDUCTOR DEVICES

5961-01-030-3308 Two or more discrete semiconductor devices such as diode(s) and/or transistor(s), permanently cased, encapsulated, or potted together to form an inseparable unit. Excludes devices having one or more components other than semiconductor devices. The individually distinct devices forming the unit may be internally connected. The unit in itself does not perform a complete specific function and cannot be assigned a more definite item name. It may include or consist of inseparable matched pairs. May or may not include mounting hardware and/or heatsink. For interconnected items arranged in stack(s), see RECTIFIER, SEMICONDUCTOR DEVICE. For items formed on or within a semiconductor material substrate, formed on an insulating substrate or formed on a combination of both of these types, see MICROCIRCUIT (as modified). Excludes NETWORK (as modified); ABSORBER, OVERVOLTAGE; SEMICONDUCTOR DEVICE SET; and SEMICONDUCTOR DEVICE ASSEMBLY. Do not use if more specific name applies.

Alternate Parts: SP3724QD, SP3724QD, SMA723308, SM-A-723308, 5961-01-030-3308, 01-030-3308, 5961010303308, 010303308

Supply Group (FSG) NSN Assigned NIIN Item Name Code (INC)
59NOV 02, 197601-030-330861962 ( SEMICONDUCTOR DEVICES, UNITIZED )
REFERENCE DRAWINGS & PICTURES
Cross Reference | NSN 5961-01-030-3308
Part Number Cage Code Manufacturer
SP3724QD07933FAIRCHILD SEMICONDUCTOR CORPSEMICONDUCTOR DIV HQ
SP3724QD11530LOCKHEED MARTIN CORPORATIONDIV LOCKHEED MARTIN INFORMATION
SM-A-72330880063US ARMY COMMUNICATIONS &ELECTRONICS MATERIEL READINESS
Technical Data | NSN 5961-01-030-3308
Characteristic Specifications
COMPONENT NAME AND QUANTITY4 TRANSISTOR
INCLOSURE MATERIAL CERAMIC
MOUNTING METHOD TERMINAL
TERMINAL TYPE AND QUANTITY14 PIN
OVERALL LENGTH0.660 INCHES MINIMUM AND 0.760 INCHES MAXIMUM
OVERALL HEIGHT0.120 INCHES MAXIMUM
OVERALL WIDTH0.220 INCHES MINIMUM AND 0.280 INCHES MAXIMUM
SPECIAL FEATURESALL TRANSISTOR JUNCTION PATTERN ARRANGEMENT: NPN