Part Details | UNITIZED SEMICONDUCTOR DEVICES
5961-01-032-0316 Two or more discrete semiconductor devices such as diode(s) and/or transistor(s), permanently cased, encapsulated, or potted together to form an inseparable unit. Excludes devices having one or more components other than semiconductor devices. The individually distinct devices forming the unit may be internally connected. The unit in itself does not perform a complete specific function and cannot be assigned a more definite item name. It may include or consist of inseparable matched pairs. May or may not include mounting hardware and/or heatsink. For interconnected items arranged in stack(s), see RECTIFIER, SEMICONDUCTOR DEVICE. For items formed on or within a semiconductor material substrate, formed on an insulating substrate or formed on a combination of both of these types, see MICROCIRCUIT (as modified). Excludes NETWORK (as modified); ABSORBER, OVERVOLTAGE; SEMICONDUCTOR DEVICE SET; and SEMICONDUCTOR DEVICE ASSEMBLY. Do not use if more specific name applies.
Alternate Parts: 19060257, 1906-0257, FSA2619P, FSA2619M, FSA2619DM, FSA2619M, 8562540001, 85625400-01, 7954752, 795475-2, 19060257, 1906-0257, FSA2619M, 149C273H01, 72069638, 720696-38, 5961-01-032-0316, 01-032-0316, 5961010320316, 010320316
| Supply Group (FSG) | NSN Assigned | NIIN | Item Name Code (INC) |
|---|---|---|---|
| 59 | DEC 05, 1976 | 01-032-0316 | 61962 ( SEMICONDUCTOR DEVICES, UNITIZED ) |
REFERENCE DRAWINGS & PICTURES
Cross Reference | NSN 5961-01-032-0316
| Part Number | Cage Code | Manufacturer |
|---|---|---|
| 1906-0257 | 50434 | AVAGO TECHNOLOGIES U.S. INC.DBA AVAGO TECHNOLOGIES |
| FSA2619P | 07263 | FAIRCHILD SEMICONDUCTOR CORP |
| FSA2619M | 07263 | FAIRCHILD SEMICONDUCTOR CORP |
| FSA2619DM | 07263 | FAIRCHILD SEMICONDUCTOR CORP |
| FSA2619M | 13715 | FAIRCHILD SEMICONDUCTOR CORPCOMPONENTS GROUP |
| 85625400-01 | 27963 | GENERAL DYNAMICS INFORMATION SYSTEMSINC. |
| 795475-2 | 73030 | HAMILTON SUNDSTRAND CORPORATION |
| 1906-0257 | 28480 | HEWLETT-PACKARD COMPANYDBA HP |
| FSA2619M | 27014 | NATIONAL SEMICONDUCTOR CORPORATION |
| 149C273H01 | 97942 | NORTHROP GRUMMAN SYSTEMS CORPORATIONDIV NORTHROP GRUMMAN SYSTEMS |
| 720696-38 | 05869 | RAYTHEON COMPANYDBA RAYTHEON |
Technical Data | NSN 5961-01-032-0316
| Characteristic | Specifications |
|---|---|
| COMPONENT NAME AND QUANTITY | 8 SEMICONDUCTOR DEVICE DIODE |
| MAXIMUM OPERATING TEMP PER MEASUREMENT POINT | 150.0 DEG CELSIUS AMBIENT AIR |
| INCLOSURE MATERIAL | PLASTIC |
| MOUNTING METHOD | PRESS FIT |
| TERMINAL TYPE AND QUANTITY | 16 RIBBON |
| OVERALL LENGTH | 0.371 INCHES MINIMUM AND 0.409 INCHES MAXIMUM |
| OVERALL HEIGHT | 0.060 INCHES MINIMUM AND 0.075 INCHES MAXIMUM |
| OVERALL WIDTH | 0.247 INCHES MINIMUM AND 0.283 INCHES MAXIMUM |
| SPECIAL FEATURES | ALL SEMICONDUCTOR DEVICE DIODE JUNCTION PATTERN ARRANGEMENT: PN |
