NSN 5961-01-069-5512

Part Details | SEMICONDUCTOR DEVICE ASSEMBLY

5961-01-069-5512 A grouping of two or more semiconducting devices such as LIGHT EMITTING DIODE; SEMICONDUCTOR DEVICE, DIODE; SEMICONDUCTOR DEVICE, PHOTO; SEMICONDUCTOR DEVICE, THYRISTOR; and/or TRANSISTOR mounted on a common mounting or mounted on each other. The devices must be separable and each item must be capable of functioning in accordance with its given name. For assemblies consisting of semiconducting devices permanently cased, encapsulated, or potted together to form a single unit, see RECTIFIER, SEMICONDUCTOR DEVICE, UNITIZED and SEMICONDUCTOR DEVICES, UNITIZED. Excludes SEMICONDUCTOR DEVICE SET; MICROCIRCUIT ASSEMBLY; and MICROCIRCUIT SET. See also ABSORBER, OVERVOLTAGE.

Alternate Parts: 72B0390231001, 72B039023-1001, MPZ532C, MPZ5-32C, 5961-01-069-5512, 01-069-5512, 5961010695512, 010695512

Supply Group (FSG) NSN Assigned NIIN Item Name Code (INC)
59DEC 19, 197801-069-551235565 ( SEMICONDUCTOR DEVICE ASSEMBLY )
REFERENCE DRAWINGS & PICTURES
Cross Reference | NSN 5961-01-069-5512
Part Number Cage Code Manufacturer
72B039023-100176301BOEING COMPANY, THEDBA BOEING
MPZ5-32C04713FREESCALE SEMICONDUCTOR, INC.
Technical Data | NSN 5961-01-069-5512
Characteristic Specifications
SPECIAL FEATURESSIX ZENER DIODES MTD BETWEEN 2 BOARDS; 2.000 IN.,1.500 IN.,0.480 IN. O/A ASSEMBLY DIM.
TEST DATA DOCUMENT76301-72B039023 DRAWING (THIS IS THE BASIC GOVERNING DRAWING, SUCH AS A CONTRACTOR DRAWING, ORIGINAL EQUIPMENT MANUFACTURER DRAWING, ETC.; EXCLUDES ANY SPECIFICATION, STANDARD OR OTHER DOCUMENT THAT MAY BE REFERENCED IN A BASIC GOVERNING DRAWING)