Part Details | TRANSISTOR
5961-01-630-6874 An active semiconductor device with three or more electrodes. May or may not include mounting hardware and/or heatsink. Excludes SEMICONDUCTOR DEVICE, DIODE and SEMICONDUCTOR DEVICE, THYRISTOR. For solid state devices which are responsive to visible or infrared radiant energy, see SEMICONDUCTOR DEVICE, PHOTO.
Alternate Parts: SI7882DPE3, SI7882DP-E3, SI7882DPT1E3, SI7882DP-T1-E3, 5961-01-630-6874, 01-630-6874, 5961016306874, 016306874
| Supply Group (FSG) | NSN Assigned | NIIN | Item Name Code (INC) |
|---|---|---|---|
| 59 | AUG 13, 2014 | 01-630-6874 | 20588 ( TRANSISTOR ) |
REFERENCE DRAWINGS & PICTURES
Cross Reference | NSN 5961-01-630-6874
| Part Number | Cage Code | Manufacturer |
|---|---|---|
| SI7882DP-E3 | 1Y409 | SILICONIX INC |
| SI7882DP-T1-E3 | 17856 | SILICONIX INCORPORATEDDIV SILICONIX |
Technical Data | NSN 5961-01-630-6874
| Characteristic | Specifications |
|---|---|
| SEMICONDUCTOR MATERIAL | SILICON ALLOY |
| VOLTAGE RATING IN VOLTS PER CHARACTERISTIC | 12.0 MAXIMUM DRAIN TO SOURCE VOLTAGE |
| CURRENT RATING PER CHARACTERISTIC | AD13.0 AMPERES MAXIMUM |
| POWER RATING PER CHARACTERISTIC | AF1.9 WATTS MAXIMUM |
| INCLOSURE MATERIAL | 0$DPC0000 |
| MOUNTING METHOD | TERMINAL |
| TERMINAL TYPE AND QUANTITY | 8 BONDING PAD |
| OVERALL LENGTH | 6.15 MILLIMETERS NOMINAL |
| OVERALL HEIGHT | 0.28 MILLIMETERS NOMINAL |
| OVERALL WIDTH | 5.15 MILLIMETERS NOMINAL |
| PART NAME ASSIGNED BY CONTROLLING AGENCY | FAST SWITCHING MOFSET |