Part Details | DIGITAL MICROCIRCUIT
5962-00-461-5194 A microcircuit specifically designed to generate, modify, or process electrical signals which operate with two distinct or binary states. These states are commonly referred to as on and off, true and false, high and low, or "1" and "0".
Alternate Parts: 15107414021, 15-107414-021, MC508F, 15107414021, 15-107414-021, 15107414021, 15-107414-021, 15107414021, 15-107414-021, 15107414021, 15-107414-021, RG140CK833B, RG140CK/833B, RG140CK833B, RG140CK/833B, RG140CK833B, RG140CK/833B, RG140CK, SG14038, SG140-38, 5962-00-461-5194, 00-461-5194, 5962004615194, 004615194
| Supply Group (FSG) | NSN Assigned | NIIN | Item Name Code (INC) |
|---|---|---|---|
| 59 | MAY 02, 1969 | 00-461-5194 | 31779 ( MICROCIRCUIT, DIGITAL ) |
REFERENCE DRAWINGS & PICTURES
Cross Reference | NSN 5962-00-461-5194
| Part Number | Cage Code | Manufacturer |
|---|---|---|
| 15-107414-021 | 04713 | FREESCALE SEMICONDUCTOR, INC. |
| MC508F | 04713 | FREESCALE SEMICONDUCTOR, INC. |
| 15-107414-021 | 04655 | GENERAL DYNAMICS MISSION SYSTEMS,INC. |
| 15-107414-021 | 54X10 | RAYTHEON COMPANYDBA RAYTHEON |
| 15-107414-021 | 49956 | RAYTHEON COMPANYDBA RAYTHEON |
| 15-107414-021 | 3B150 | RAYTHEON COMPANYDBA RAYTHEON |
| RG140CK/833B | 54X10 | RAYTHEON COMPANYDBA RAYTHEON |
| RG140CK/833B | 49956 | RAYTHEON COMPANYDBA RAYTHEON |
| RG140CK/833B | 3B150 | RAYTHEON COMPANYDBA RAYTHEON |
| RG140CK | 21688 | RAYTHEON DATA SYSTEMS CO |
| SG140-38 | 93332 | SYLVANIA ELECTRIC PRODUCTS INCSEMICONDUCTOR PRODUCTS DIV |
Technical Data | NSN 5962-00-461-5194
| Characteristic | Specifications |
|---|---|
| OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
| DESIGN FUNCTION AND QUANTITY | 4 GATE, NAND |
| INPUT CIRCUIT PATTERN | QUAD 2 INPUT |
| VOLTAGE RATING AND TYPE PER CHARACTERISTIC | ACV8.0 VOLTS MAXIMUM |
| TIME RATING PER CHACTERISTIC | AEE20.00 NANOSECONDS MAXIMUM AND AED20.00 NANOSECONDS MAXIMUM |
| OPERATING TEMP RANGE | -55.0 TO +125.0 DEG CELSIUS |
| TERMINAL TYPE AND QUANTITY | 14 FLAT LEADS |
| TERMINAL SURFACE TREATMENT | SOLDER |
| INCLOSURE CONFIGURATION | FLAT PACK |
| INCLOSURE MATERIAL | CERAMIC |
| BODY LENGTH | 0.235 INCHES MINIMUM AND 0.255 INCHES MAXIMUM |
| BODY HEIGHT | 0.030 INCHES MINIMUM AND 0.070 INCHES MAXIMUM |
| BODY WIDTH | 0.180 INCHES MINIMUM AND 0.210 INCHES MAXIMUM |
| MAXIMUM POWER DISSIPATION RATING | 60.0 MILLIWATTS |
| STORAGE TEMP RANGE | -65.0 TO +150.0 DEG CELSIUS |
| FEATURES PROVIDED | HERMETICALLY SEALED AND BURN IN AND MONOLITHIC AND POSITIVE OUTPUTS |
| TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |