Part Details | MEMORY MICROCIRCUIT
5962-00-530-4663 A circuit designed to store information and/or coded instructions. Item has pins or other connections to install in a computer or computing device. Does not include magnetic drums, tapes, punched cards or the like. For items that have portable type connections see MEMORY, PORTABLE, SOLID STATE.
Alternate Parts: 310131P9, DMS80015B, SL8200J1, C4792Q, C4792P, CC530Q, RX6965, RX5893, RM8200N, RM8200N, 932299501B, 932299-501B, RX6965, RX6965, 5962-00-530-4663, 00-530-4663, 5962005304663, 005304663
| Supply Group (FSG) | NSN Assigned | NIIN | Item Name Code (INC) |
|---|---|---|---|
| 59 | SEP 07, 1974 | 00-530-4663 | 41015 ( MICROCIRCUIT, MEMORY ) |
REFERENCE DRAWINGS & PICTURES
Cross Reference | NSN 5962-00-530-4663
| Part Number | Cage Code | Manufacturer |
|---|---|---|
| 310131P9 | 94117 | BAE SYSTEMS INFORMATION ANDELECTRONIC SYSTEMS INTEGRATION INC. |
| DMS80015B | 16236 | DLA LAND AND MARITIMEDBA ENGINEERING AND TECHNICAL |
| SL8200J1 | 58625 | LANSDALE SEMICONDUCTOR, INC. |
| C4792Q | 18324 | PHILIPS SEMICONDUCTORS INC |
| C4792P | 18324 | PHILIPS SEMICONDUCTORS INC |
| CC530Q | 18324 | PHILIPS SEMICONDUCTORS INC |
| RX6965 | 3B150 | RAYTHEON COMPANYDBA RAYTHEON |
| RX5893 | 49956 | RAYTHEON COMPANYDBA RAYTHEON |
| RM8200N | 49956 | RAYTHEON COMPANYDBA RAYTHEON |
| RM8200N | 3B150 | RAYTHEON COMPANYDBA RAYTHEON |
| 932299-501B | 82577 | RAYTHEON COMPANYDBA RAYTHEON |
| RX6965 | 54X10 | RAYTHEON COMPANYDBA RAYTHEON |
| RX6965 | 49956 | RAYTHEON COMPANYDBA RAYTHEON |
Technical Data | NSN 5962-00-530-4663
| Characteristic | Specifications |
|---|---|
| OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
| INPUT CIRCUIT PATTERN | DUAL 6 INPUT |
| VOLTAGE RATING AND TYPE PER CHARACTERISTIC | ACV5.5 VOLTS MAXIMUM |
| TIME RATING PER CHACTERISTIC | AEE40.00 NANOSECONDS MAXIMUM AND AED45.00 NANOSECONDS MAXIMUM |
| MEMORY DEVICE TYPE | ROM |
| MEMORY CAPACITY | UNKNOWN |
| OPERATING TEMP RANGE | -55.0 TO +125.0 DEG CELSIUS |
| TERMINAL TYPE AND QUANTITY | 24 FLAT LEADS |
| TERMINAL SURFACE TREATMENT | SOLDER |
| INCLOSURE CONFIGURATION | FLAT PACK |
| INCLOSURE MATERIAL | CERAMIC AND GLASS |
| BODY LENGTH | 0.370 INCHES MINIMUM AND 0.395 INCHES MAXIMUM |
| BODY HEIGHT | 0.050 INCHES MINIMUM AND 0.080 INCHES MAXIMUM |
| BODY WIDTH | 0.245 INCHES MINIMUM AND 0.275 INCHES MAXIMUM |
| MAXIMUM POWER DISSIPATION RATING | 580.0 MILLIWATTS |
| STORAGE TEMP RANGE | -65.0 TO +200.0 DEG CELSIUS |
| FEATURES PROVIDED | MONOLITHIC AND HERMETICALLY SEALED AND NEGATIVE EDGE TRIGGERED AND POSITIVE OUTPUTS |
| SPECIAL FEATURES | FORMED LEADS |
| TEST DATA DOCUMENT | 94117-310131 SPECIFICATION (INCLUDES ENGINEERING TYPE BULLETINS, BROCHURES,ETC., THAT REFLECT SPECIFICATION TYPE DATA IN SPECIFICATION FORMAT; EXCLUDES COMMERCIAL CATALOGS, INDUSTRY DIRECTORIES, AND SIMILAR TRADE PUBLICATIONS, REFLECTING GENERAL TYPE DATA ON CERTAIN ENVIRONMENTAL AND PERFORMANCE REQUIREMENTS AND TEST CONDITIONS THAT ARE SHOWN AS "TYPICAL", "AVERAGE", "NOMINAL", ETC.). |
| PRECIOUS MATERIAL | GOLD |
| PRECIOUS MATERIAL AND LOCATION | TERMINAL SURFACE GOLD |