Part Details | DIGITAL MICROCIRCUIT
5962-00-824-4642 A microcircuit specifically designed to generate, modify, or process electrical signals which operate with two distinct or binary states. These states are commonly referred to as on and off, true and false, high and low, or "1" and "0".
Alternate Parts: 26037972, 2603797-2, 932FC, U3I993259X, MC832F, 9322, M1C9325B, M1C932-5B, MIC9323, MIC932-3, G000370932, G000370-932, PL993259, SW9322F, SW932-2F, SN15832U, SN15832H, 5962-00-824-4642, 00-824-4642, 5962008244642, 008244642
| Supply Group (FSG) | NSN Assigned | NIIN | Item Name Code (INC) |
|---|---|---|---|
| 59 | AUG 14, 1967 | 00-824-4642 | 31779 ( MICROCIRCUIT, DIGITAL ) |
REFERENCE DRAWINGS & PICTURES
Cross Reference | NSN 5962-00-824-4642
| Part Number | Cage Code | Manufacturer |
|---|---|---|
| 2603797-2 | 06424 | ALLIANT TECHSYSTEMS OPERATIONS LLCDIV DEFENSE ELECTRONIC SYSTEMS |
| 932FC | 07263 | FAIRCHILD SEMICONDUCTOR CORP |
| U3I993259X | 07263 | FAIRCHILD SEMICONDUCTOR CORP |
| MC832F | 04713 | FREESCALE SEMICONDUCTOR, INC. |
| 9322 | 98738 | HERLEY CHICAGODBA STEWART WARNER ELECTRONICS |
| M1C932-5B | 14433 | ITT SEMICONDUCTORS DIV |
| MIC932-3 | 15238 | ITT SEMICONDUCTORSA DIVISION OF INTERNATIONAL |
| G000370-932 | 05395 | L-3 COMMUNICATIONS CORPORATIONDBA MISSION INTEGRATION DIVISION |
| PL993259 | 15124 | PHILCO-FORD CORPMICROELECTRONICS DIV |
| SW932-2F | 27318 | STEWART-WARNER CORP MICROCIRCUITSDIV |
| SN15832U | 01295 | TEXAS INSTRUMENTS INCORPORATEDDBA TEXAS INSTRUMENTS |
| SN15832H | 01295 | TEXAS INSTRUMENTS INCORPORATEDDBA TEXAS INSTRUMENTS |
Technical Data | NSN 5962-00-824-4642
| Characteristic | Specifications |
|---|---|
| OUTPUT LOGIC FORM | DIODE-TRANSISTOR LOGIC |
| DESIGN FUNCTION AND QUANTITY | 2 BUFFER, NAND |
| INPUT CIRCUIT PATTERN | DUAL 4 INPUT |
| VOLTAGE RATING AND TYPE PER CHARACTERISTIC | ACV5.0 VOLTS MAXIMUM |
| TIME RATING PER CHACTERISTIC | AEE35.00 NANOSECONDS MAXIMUM |
| OPERATING TEMP RANGE | -0.0 TO +75.0 DEG CELSIUS |
| TERMINAL TYPE AND QUANTITY | 14 FLAT LEADS |
| TERMINAL SURFACE TREATMENT | SOLDER |
| INCLOSURE CONFIGURATION | FLAT PACK |
| INCLOSURE MATERIAL | CERAMIC |
| CASE OUTLINE SOURCE AND DESIGNATOR | T0-86 JOINT ELECTRON DEVICE ENGINEERING COUNCIL |
| BODY LENGTH | 0.275 INCHES MAXIMUM |
| BODY HEIGHT | 0.065 INCHES MAXIMUM |
| BODY WIDTH | 0.275 INCHES MAXIMUM |
| MAXIMUM POWER DISSIPATION RATING | 120.0 MILLIWATTS |
| STORAGE TEMP RANGE | -65.0 TO +150.0 DEG CELSIUS |
| FEATURES PROVIDED | HERMETICALLY SEALED AND W/EXPANDER |