NSN 5962-01-077-6118

Part Details | MEMORY MICROCIRCUIT

5962-01-077-6118 A circuit designed to store information and/or coded instructions. Item has pins or other connections to install in a computer or computing device. Does not include magnetic drums, tapes, punched cards or the like. For items that have portable type connections see MEMORY, PORTABLE, SOLID STATE.

Alternate Parts: 310429P2, 900348, DMS 91137B, 7300045, 730-0045, AM3705D883B, AM3705DM, 3517449021, 351-7449-021, DG501BP, DG501AP883C, DG501AP/883C, DG501AP883B2, DG501AP/883B-2, DG501AP883B, DG501AP/883B, DG501AP4, DG501AP-4, DG501AP2, DG501AP-2, 0213111502, 0213-1-1150-2, 5962-01-077-6118, 01-077-6118, 5962010776118, 010776118

Supply Group (FSG) NSN Assigned NIIN Item Name Code (INC)
59MAY 26, 197901-077-611841015 ( MICROCIRCUIT, MEMORY )
REFERENCE DRAWINGS & PICTURES
Cross Reference | NSN 5962-01-077-6118
Part Number Cage Code Manufacturer
310429P294117BAE SYSTEMS INFORMATION ANDELECTRONIC SYSTEMS INTEGRATION INC.
90034833827BAE SYSTEMS INTEGRATED DEFENSESOLUTIONS INC.
DMS 91137B16236DLA LAND AND MARITIMEDBA ENGINEERING AND TECHNICAL
730-004522818HUBBELL HARVEY INCPULSECOM DIV
AM3705D883B27014NATIONAL SEMICONDUCTOR CORPORATION
AM3705DM27014NATIONAL SEMICONDUCTOR CORPORATION
351-7449-02113499ROCKWELL COLLINS, INC.DBA GOVERNMENT SYSTEMS
DG501BP17856SILICONIX INCORPORATEDDIV SILICONIX
DG501AP/883C17856SILICONIX INCORPORATEDDIV SILICONIX
DG501AP/883B-217856SILICONIX INCORPORATEDDIV SILICONIX
DG501AP/883B17856SILICONIX INCORPORATEDDIV SILICONIX
DG501AP-417856SILICONIX INCORPORATEDDIV SILICONIX
DG501AP-217856SILICONIX INCORPORATEDDIV SILICONIX
0213-1-1150-215942USACECOM INTELLIGENCE ELECTRONICWARFARE SENSORS DIRECTORATE
Technical Data | NSN 5962-01-077-6118
Characteristic Specifications
OUTPUT LOGIC FORM N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC
INPUT CIRCUIT PATTERN 8 INPUT
VOLTAGE RATING AND TYPE PER CHARACTERISTICACV5.0 VOLTS MAXIMUM
TIME RATING PER CHACTERISTICAEE1500.00 NANOSECONDS MAXIMUM AND AED2500.00 NANOSECONDS MAXIMUM
MEMORY DEVICE TYPE ROM
OPERATING TEMP RANGE-55.0 TO +125.0 DEG CELSIUS
TERMINAL TYPE AND QUANTITY16 PRINTED CIRCUIT
TERMINAL SURFACE TREATMENT SOLDER
INCLOSURE CONFIGURATION DUAL-IN-LINE
INCLOSURE MATERIAL CERAMIC AND GLASS
CASE OUTLINE SOURCE AND DESIGNATORD-2 MIL-M-38510
BODY LENGTH0.840 INCHES MAXIMUM
BODY HEIGHT0.140 INCHES MINIMUM AND 0.185 INCHES MAXIMUM
BODY WIDTH0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM
MAXIMUM POWER DISSIPATION RATING450.0 MILLIWATTS
STORAGE TEMP RANGE-65.0 TO +150.0 DEG CELSIUS
FEATURES PROVIDED MONOLITHIC AND NEGATIVE OUTPUTS AND POSITIVE OUTPUTS AND W/ENABLE
TEST DATA DOCUMENT15942-0213-1-1150-2 DRAWING (THIS IS THE BASIC GOVERNING DRAWING, SUCH AS A CONTRACTOR DRAWING, ORIGINAL EQUIPMENT MANUFACTURER DRAWING, ETC.; EXCLUDES ANY SPECIFICATION, STANDARD OR OTHER DOCUMENT THAT MAY BE REFERENCED IN A BASIC GOVERNING DRAWING)