NSN 5962-01-082-2008

Part Details | MEMORY MICROCIRCUIT

5962-01-082-2008 A circuit designed to store information and/or coded instructions. Item has pins or other connections to install in a computer or computing device. Does not include magnetic drums, tapes, punched cards or the like. For items that have portable type connections see MEMORY, PORTABLE, SOLID STATE.

Alternate Parts: 18180264, 1818-0264, 18180264, 1818-0264, 18180264, 1818-0264, MK31000P, SYNC2316AMASKED, SYC2316A, C27105, 5962-01-082-2008, 01-082-2008, 5962010822008, 010822008

Supply Group (FSG) NSN Assigned NIIN Item Name Code (INC)
59AUG 28, 197901-082-200841015 ( MICROCIRCUIT, MEMORY )
REFERENCE DRAWINGS & PICTURES
Cross Reference | NSN 5962-01-082-2008
Part Number Cage Code Manufacturer
1818-026428480HEWLETT-PACKARD COMPANYDBA HP
1818-02641LQK8KEYSIGHT TECHNOLOGIES, INC.
1818-026450088STMICROELECTRONICS INC
MK31000P50088STMICROELECTRONICS INC
SYNC2316AMASKED55576SYNERTEK
SYC2316A55576SYNERTEK
C2710555576SYNERTEK
Technical Data | NSN 5962-01-082-2008
Characteristic Specifications
OUTPUT LOGIC FORM N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC
INPUT CIRCUIT PATTERN 14 INPUT
VOLTAGE RATING AND TYPE PER CHARACTERISTICACV7.0 VOLTS MAXIMUM
TIME RATING PER CHACTERISTICAEE550.00 NANOSECONDS MAXIMUM AND AED550.00 NANOSECONDS MAXIMUM
MEMORY DEVICE TYPE ROM
WORD QUANTITY2048
BIT QUANTITY16384
OPERATING TEMP RANGE+0.0 TO +70.0 DEG CELSIUS
TERMINAL TYPE AND QUANTITY24 PRINTED CIRCUIT
TERMINAL SURFACE TREATMENT SOLDER
INCLOSURE CONFIGURATION DUAL-IN-LINE
INCLOSURE MATERIAL CERAMIC AND GLASS
BODY LENGTH1.290 INCHES MAXIMUM
BODY HEIGHT0.140 INCHES MINIMUM AND 0.180 INCHES MAXIMUM
BODY WIDTH0.590 INCHES MINIMUM AND 0.625 INCHES MAXIMUM
MAXIMUM POWER DISSIPATION RATING1.0 WATTS
STORAGE TEMP RANGE-65.0 TO +150.0 DEG CELSIUS
FEATURES PROVIDED ASYNCHRONOUS AND HERMETICALLY SEALED AND HIGH PERFORMANCE AND MONOLITHIC AND POSITIVE OUTPUTS AND PROGRAMMABLE AND 3-STATE OUTPUT