Part Details | MEMORY MICROCIRCUIT
5962-01-092-2733 A circuit designed to store information and/or coded instructions. Item has pins or other connections to install in a computer or computing device. Does not include magnetic drums, tapes, punched cards or the like. For items that have portable type connections see MEMORY, PORTABLE, SOLID STATE.
Alternate Parts: ROMPROM FAMILY 005, ROM/PROM FAMILY 005, HPR0M110242G35, HPR0M1-1024-2G35, HPROM110242G3567, HPROM1-1024-2G3567, HPROM110242G3567, HPROM1-1024-2G3567, HM176112G3567, HM1-7611-2-G3567, DM7574ABAJ883, DM7574ABA/J/883, 247ASC2615001, 247ASC2615-001, CW854F, 5962-01-092-2733, 01-092-2733, 5962010922733, 010922733
| Supply Group (FSG) | NSN Assigned | NIIN | Item Name Code (INC) |
|---|---|---|---|
| 59 | MAR 22, 1980 | 01-092-2733 | 41015 ( MICROCIRCUIT, MEMORY ) |
REFERENCE DRAWINGS & PICTURES
Cross Reference | NSN 5962-01-092-2733
| Part Number | Cage Code | Manufacturer |
|---|---|---|
| ROM/PROM FAMILY 005 | 16236 | DLA LAND AND MARITIMEDBA ENGINEERING AND TECHNICAL |
| HPR0M1-1024-2G35 | 91417 | HARRIS CORPORATIONDBA GOVERNMENT COMMUNICATIONS |
| HPROM1-1024-2G3567 | 91417 | HARRIS CORPORATIONDBA GOVERNMENT COMMUNICATIONS |
| HPROM1-1024-2G3567 | 34371 | INTERSIL CORPORATIONDIV NA |
| HM1-7611-2-G3567 | 34371 | INTERSIL CORPORATIONDIV NA |
| DM7574ABA/J/883 | 27014 | NATIONAL SEMICONDUCTOR CORPORATION |
| 247ASC2615-001 | 30003 | NAVAL AIR SYSTEMS COMMAND MANAGEDORIGINAL DESIGN ACTIVITY NOT |
| CW854F | 18324 | PHILIPS SEMICONDUCTORS INC |
Technical Data | NSN 5962-01-092-2733
| Characteristic | Specifications |
|---|---|
| OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
| INPUT CIRCUIT PATTERN | 10 INPUT |
| VOLTAGE RATING AND TYPE PER CHARACTERISTIC | ACV5.5 VOLTS MAXIMUM |
| TIME RATING PER CHACTERISTIC | AEE35.00 NANOSECONDS MAXIMUM AND AED35.00 NANOSECONDS MAXIMUM |
| MEMORY DEVICE TYPE | ROM |
| MEMORY CAPACITY | UNKNOWN |
| OPERATING TEMP RANGE | -55.0 TO +125.0 DEG CELSIUS |
| TERMINAL TYPE AND QUANTITY | 16 PRINTED CIRCUIT |
| TERMINAL SURFACE TREATMENT | SOLDER |
| INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| INCLOSURE MATERIAL | CERAMIC AND GLASS |
| BODY LENGTH | 0.747 INCHES MINIMUM AND 0.815 INCHES MAXIMUM |
| BODY HEIGHT | 0.200 INCHES MAXIMUM |
| BODY WIDTH | 0.310 INCHES MAXIMUM |
| MAXIMUM POWER DISSIPATION RATING | 556.0 MILLIWATTS |
| STORAGE TEMP RANGE | -65.0 TO +150.0 DEG CELSIUS |
| FEATURES PROVIDED | HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND BIPOLAR AND W/STORAGE AND PROGRAMMABLE AND PROGRAMMED AND W/ENABLE AND W/DISABLE AND HIGH SPEED |
| TEST DATA DOCUMENT | 30003-247AS-2615 DRAWING (THIS IS THE BASIC GOVERNING DRAWING, SUCH AS A CONTRACTOR DRAWING, ORIGINAL EQUIPMENT MANUFACTURER DRAWING, ETC.; EXCLUDES ANY SPECIFICATION, STANDARD OR OTHER DOCUMENT THAT MAY BE REFERENCED IN A BASIC GOVERNING DRAWING) |