Part Details | MEMORY MICROCIRCUIT
5962-01-099-8507 A circuit designed to store information and/or coded instructions. Item has pins or other connections to install in a computer or computing device. Does not include magnetic drums, tapes, punched cards or the like. For items that have portable type connections see MEMORY, PORTABLE, SOLID STATE.
Alternate Parts: AM27S20PC, 18160140, 1816-0140, 93417PC, 18160140, 1816-0140, 18160140, 1816-0140, 18160140, 1816-0140, 63001, 6300-1, 18160140, 1816-0140, DM74S387N, 18160140, 1816-0140, 18160140, 1816-0140, N82S126N, 5962-01-099-8507, 01-099-8507, 5962010998507, 010998507
| Supply Group (FSG) | NSN Assigned | NIIN | Item Name Code (INC) |
|---|---|---|---|
| 59 | AUG 24, 1980 | 01-099-8507 | 41015 ( MICROCIRCUIT, MEMORY ) |
REFERENCE DRAWINGS & PICTURES
Cross Reference | NSN 5962-01-099-8507
| Part Number | Cage Code | Manufacturer |
|---|---|---|
| AM27S20PC | 34335 | ADVANCED MICRO DEVICES, INC.DBA A M D |
| 1816-0140 | 34335 | ADVANCED MICRO DEVICES, INC.DBA A M D |
| 93417PC | 07263 | FAIRCHILD SEMICONDUCTOR CORP |
| 1816-0140 | 07263 | FAIRCHILD SEMICONDUCTOR CORP |
| 1816-0140 | 28480 | HEWLETT-PACKARD COMPANYDBA HP |
| 1816-0140 | 1LQK8 | KEYSIGHT TECHNOLOGIES, INC. |
| 6300-1 | 50364 | MMI/AMD |
| 1816-0140 | 50364 | MMI/AMD |
| DM74S387N | 27014 | NATIONAL SEMICONDUCTOR CORPORATION |
| 1816-0140 | 27014 | NATIONAL SEMICONDUCTOR CORPORATION |
| 1816-0140 | 18324 | PHILIPS SEMICONDUCTORS INC |
| N82S126N | 18324 | PHILIPS SEMICONDUCTORS INC |
Technical Data | NSN 5962-01-099-8507
| Characteristic | Specifications |
|---|---|
| OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
| INPUT CIRCUIT PATTERN | 10 INPUT |
| VOLTAGE RATING AND TYPE PER CHARACTERISTIC | ACV5.5 VOLTS MAXIMUM |
| TIME RATING PER CHACTERISTIC | AEE60.00 NANOSECONDS MAXIMUM AND AED60.00 NANOSECONDS MAXIMUM |
| MEMORY DEVICE TYPE | ROM |
| MEMORY CAPACITY | UNKNOWN |
| OPERATING TEMP RANGE | -55.0 TO +125.0 DEG CELSIUS |
| TERMINAL TYPE AND QUANTITY | 16 PRINTED CIRCUIT |
| TERMINAL SURFACE TREATMENT | SOLDER |
| INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| INCLOSURE MATERIAL | CERAMIC AND GLASS |
| BODY LENGTH | 0.755 INCHES MINIMUM AND 0.785 INCHES MAXIMUM |
| BODY HEIGHT | 0.150 INCHES MINIMUM AND 0.199 INCHES MAXIMUM |
| BODY WIDTH | 0.265 INCHES MINIMUM AND 0.291 INCHES MAXIMUM |
| STORAGE TEMP RANGE | -65.0 TO +150.0 DEG CELSIUS |
| FEATURES PROVIDED | HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND BIPOLAR AND W/DECODED OUTPUT AND SCHOTTKY AND PROGRAMMABLE AND PROGRAMMED |