Part Details | MEMORY MICROCIRCUIT
5962-01-102-3846 A circuit designed to store information and/or coded instructions. Item has pins or other connections to install in a computer or computing device. Does not include magnetic drums, tapes, punched cards or the like. For items that have portable type connections see MEMORY, PORTABLE, SOLID STATE.
Alternate Parts: AMD9214DM, 940200129, 9402-00129, 4771768003, 477-1768-003, 4771336031, 477-1336-031, ROMPROM HEAD 026, ROM/PROM HEAD 026, 583R350H01, 8569460003, 85694600-03, D3624, HM176415, HM1-7641-5, IM5625CJG, IM5625-CJG, SL82S141BJA, SL82S141/BJA, 7849878P001, 59623820802BJX, 5962-3820802BJX, 59623820802BJB, 5962-3820802BJB, 59623820802BJA, 5962-3820802BJA, M3851020802BJB, M38510/20802BJB, M3851020802BJA, M38510/20802BJA, M3851020802BJ, M38510/20802BJ, MILM38510208, MIL-M-38510/208, JM3851020802BJX, JM38510/20802BJX, 63411J, 6341-1J, DM54S474JMIL, DM54S474J/MIL, DM54S474J, 917AS8044, 2898447, 583R350H01, S82S141I883B, S82S141I/883B, N82S141F, H201362404, H201-3624-04, 400478508, 4004785-08, 400478501, 4004785-01, 100448701, 1004487-01, 82S141BJA, 82S141/BJA, 5962-01-102-3846, 01-102-3846, 5962011023846, 011023846
| Supply Group (FSG) | NSN Assigned | NIIN | Item Name Code (INC) |
|---|---|---|---|
| 59 | OCT 18, 1980 | 01-102-3846 | 41015 ( MICROCIRCUIT, MEMORY ) |
REFERENCE DRAWINGS & PICTURES
Cross Reference | NSN 5962-01-102-3846
| Part Number | Cage Code | Manufacturer |
|---|---|---|
| AMD9214DM | 34335 | ADVANCED MICRO DEVICES, INC.DBA A M D |
| 9402-00129 | K0656 | BAE SYSTEMS (OPERATIONS) LIMITEDDBA BAE SYSTEMS PLC |
| 477-1768-003 | 94756 | BOEING COMPANY, THEDBA BOEING |
| 477-1336-031 | 94756 | BOEING COMPANY, THEDBA BOEING |
| ROM/PROM HEAD 026 | 16236 | DLA LAND AND MARITIMEDBA ENGINEERING AND TECHNICAL |
| 583R350H01 | 07263 | FAIRCHILD SEMICONDUCTOR CORP |
| 85694600-03 | 27963 | GENERAL DYNAMICS INFORMATION SYSTEMSINC. |
| D3624 | 34649 | INTEL CORP SALES OFFICE |
| HM1-7641-5 | 34371 | INTERSIL CORPORATIONDIV NA |
| IM5625-CJG | 32293 | INTERSIL INCSUB OF GENERAL ELECTRIC CO |
| SL82S141/BJA | 58625 | LANSDALE SEMICONDUCTOR, INC. |
| 7849878P001 | 03538 | LOCKHEED MARTIN CORPORATIONDIV RMS |
| 5962-3820802BJX | 81349 | MILITARY SPECIFICATIONSPROMULGATED BY MILITARY |
| 5962-3820802BJB | 81349 | MILITARY SPECIFICATIONSPROMULGATED BY MILITARY |
| 5962-3820802BJA | 81349 | MILITARY SPECIFICATIONSPROMULGATED BY MILITARY |
| M38510/20802BJB | 81349 | MILITARY SPECIFICATIONSPROMULGATED BY MILITARY |
| M38510/20802BJA | 81349 | MILITARY SPECIFICATIONSPROMULGATED BY MILITARY |
| M38510/20802BJ | 81349 | MILITARY SPECIFICATIONSPROMULGATED BY MILITARY |
| MIL-M-38510/208 | 81349 | MILITARY SPECIFICATIONSPROMULGATED BY MILITARY |
| JM38510/20802BJX | 81349 | MILITARY SPECIFICATIONSPROMULGATED BY MILITARY |
| 6341-1J | 50364 | MMI/AMD |
| DM54S474J/MIL | 27014 | NATIONAL SEMICONDUCTOR CORPORATION |
| DM54S474J | 27014 | NATIONAL SEMICONDUCTOR CORPORATION |
| 917AS8044 | 30003 | NAVAL AIR SYSTEMS COMMAND MANAGEDORIGINAL DESIGN ACTIVITY NOT |
| 2898447 | 53711 | NAVAL SEA SYSTEMS COMMAND |
| 583R350H01 | 97942 | NORTHROP GRUMMAN SYSTEMS CORPORATIONDIV NORTHROP GRUMMAN SYSTEMS |
| S82S141I/883B | 18324 | PHILIPS SEMICONDUCTORS INC |
| N82S141F | 18324 | PHILIPS SEMICONDUCTORS INC |
| H201-3624-04 | 51504 | RAVEN ELECTRONICS CORPORATION |
| 4004785-08 | 36378 | RAYTHEON TECHNICAL SERVICES COMPANY |
| 4004785-01 | 36378 | RAYTHEON TECHNICAL SERVICES COMPANY |
| 1004487-01 | 36378 | RAYTHEON TECHNICAL SERVICES COMPANY |
| 82S141/BJA | 0C7V7 | TELEDYNE E2V US, INC.DBA TELEDYNE E2V (US) |
Technical Data | NSN 5962-01-102-3846
| Characteristic | Specifications |
|---|---|
| OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
| INPUT CIRCUIT PATTERN | 13 INPUT |
| VOLTAGE RATING AND TYPE PER CHARACTERISTIC | ACV5.5 VOLTS MAXIMUM |
| TIME RATING PER CHACTERISTIC | AEE90.00 NANOSECONDS MAXIMUM AND AED90.00 NANOSECONDS MAXIMUM |
| MEMORY DEVICE TYPE | ROM |
| MEMORY CAPACITY | UNKNOWN |
| OPERATING TEMP RANGE | -55.0 TO +125.0 DEG CELSIUS |
| TERMINAL TYPE AND QUANTITY | 24 PRINTED CIRCUIT |
| TERMINAL SURFACE TREATMENT | SOLDER |
| INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| INCLOSURE MATERIAL | CERAMIC |
| CASE OUTLINE SOURCE AND DESIGNATOR | D-3 MIL-M-38510 |
| BODY LENGTH | 1.290 INCHES MAXIMUM |
| BODY HEIGHT | 0.210 INCHES MAXIMUM |
| BODY WIDTH | 0.500 INCHES MINIMUM AND 0.610 INCHES MAXIMUM |
| MAXIMUM POWER DISSIPATION RATING | 1.02 WATTS |
| STORAGE TEMP RANGE | -65.0 TO +150.0 DEG CELSIUS |
| FEATURES PROVIDED | HERMETICALLY SEALED AND MONOLITHIC AND SCHOTTKY AND BIPOLAR AND PROGRAMMABLE AND POSITIVE OUTPUTS |
| TEST DATA DOCUMENT | 81349-MIL-M-38510 SPECIFICATION (INCLUDES ENGINEERING TYPE BULLETINS, BROCHURES,ETC., THAT REFLECT SPECIFICATION TYPE DATA IN SPECIFICATION FORMAT; EXCLUDES COMMERCIAL CATALOGS, INDUSTRY DIRECTORIES, AND SIMILAR TRADE PUBLICATIONS, REFLECTING GENERAL TYPE DATA ON CERTAIN ENVIRONMENTAL AND PERFORMANCE REQUIREMENTS AND TEST CONDITIONS THAT ARE SHOWN AS "TYPICAL", "AVERAGE", "NOMINAL", ETC.). |
| SPECIFICATION/STANDARD DATA | 81349-MIL-M-38510 TO 208 TO UAF TO GOVERNMENT SPECIFICATION |