NSN 5962-01-106-0879

Part Details | MEMORY MICROCIRCUIT

5962-01-106-0879 A circuit designed to store information and/or coded instructions. Item has pins or other connections to install in a computer or computing device. Does not include magnetic drums, tapes, punched cards or the like. For items that have portable type connections see MEMORY, PORTABLE, SOLID STATE.

Alternate Parts: ROMPROM FAMILY 013, ROM/PROM FAMILY 013, 53311D883C, 5331-1D/883C, 72291350, 722913-50, 7229132, 722913-2, 41220, 5962-01-106-0879, 01-106-0879, 5962011060879, 011060879

Supply Group (FSG) NSN Assigned NIIN Item Name Code (INC)
59JAN 11, 198101-106-087941015 ( MICROCIRCUIT, MEMORY )
REFERENCE DRAWINGS & PICTURES
Cross Reference | NSN 5962-01-106-0879
Part Number Cage Code Manufacturer
ROM/PROM FAMILY 01316236DLA LAND AND MARITIMEDBA ENGINEERING AND TECHNICAL
5331-1D/883C50364MMI/AMD
722913-5005869RAYTHEON COMPANYDBA RAYTHEON
722913-205869RAYTHEON COMPANYDBA RAYTHEON
4122005869RAYTHEON COMPANYDBA RAYTHEON
Technical Data | NSN 5962-01-106-0879
Characteristic Specifications
OUTPUT LOGIC FORM TRANSISTOR-TRANSISTOR LOGIC
INPUT CIRCUIT PATTERN 6 INPUT
VOLTAGE RATING AND TYPE PER CHARACTERISTICACV7.0 VOLTS NOMINAL
TIME RATING PER CHACTERISTICAEE70.00 NANOSECONDS MAXIMUM AND AED70.00 NANOSECONDS MAXIMUM
MEMORY DEVICE TYPE ROM
MEMORY CAPACITYUNKNOWN
OPERATING TEMP RANGE-55.0 TO +125.0 DEG CELSIUS
TERMINAL TYPE AND QUANTITY16 PRINTED CIRCUIT
TERMINAL SURFACE TREATMENT SOLDER
INCLOSURE CONFIGURATION DUAL-IN-LINE
INCLOSURE MATERIAL CERAMIC
CASE OUTLINE SOURCE AND DESIGNATORD-2 MIL-M-38510
BODY LENGTH0.840 INCHES MAXIMUM
BODY HEIGHT0.185 INCHES MAXIMUM
BODY WIDTH0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM
MAXIMUM POWER DISSIPATION RATING500.0 MILLIWATTS
STORAGE TEMP RANGE-65.0 TO +150.0 DEG CELSIUS
FEATURES PROVIDED HERMETICALLY SEALED AND BURN IN AND PROGRAMMABLE AND 3-STATE OUTPUT
TEST DATA DOCUMENT96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).