NSN 5962-01-241-5589

Part Details | MEMORY MICROCIRCUIT

5962-01-241-5589 A circuit designed to store information and/or coded instructions. Item has pins or other connections to install in a computer or computing device. Does not include magnetic drums, tapes, punched cards or the like. For items that have portable type connections see MEMORY, PORTABLE, SOLID STATE.

Alternate Parts: ROMPROM FAMILY 156, ROM/PROM FAMILY 156, NMC27C32QE45, NMC27C32QE-45, 701802, 177B80504, 177B805-04, 5962-01-241-5589, 01-241-5589, 5962012415589, 012415589

Supply Group (FSG) NSN Assigned NIIN Item Name Code (INC)
59SEP 27, 198601-241-558941015 ( MICROCIRCUIT, MEMORY )
REFERENCE DRAWINGS & PICTURES
Cross Reference | NSN 5962-01-241-5589
Part Number Cage Code Manufacturer
ROM/PROM FAMILY 15616236DLA LAND AND MARITIMEDBA ENGINEERING AND TECHNICAL
NMC27C32QE-4527014NATIONAL SEMICONDUCTOR CORPORATION
70180256183TX TECHNOLOGY CORP.DBA CHATLOS SYSTEMS
177B805-0456183TX TECHNOLOGY CORP.DBA CHATLOS SYSTEMS
Technical Data | NSN 5962-01-241-5589
Characteristic Specifications
OUTPUT LOGIC FORM COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
INPUT CIRCUIT PATTERN 14 INPUT
VOLTAGE RATING AND TYPE PER CHARACTERISTICACV6.0 VOLTS MAXIMUM
TIME RATING PER CHACTERISTICAEE450.00 NANOSECONDS MAXIMUM AND AED450.00 NANOSECONDS MAXIMUM
MEMORY DEVICE TYPE ROM
OPERATING TEMP RANGE-40.0 TO +85.0 DEG CELSIUS
TERMINAL TYPE AND QUANTITY24 PRINTED CIRCUIT
TERMINAL SURFACE TREATMENT SOLDER
INCLOSURE CONFIGURATION DUAL-IN-LINE
INCLOSURE MATERIAL CERAMIC
BODY LENGTH1.290 INCHES MAXIMUM
BODY HEIGHT0.205 INCHES MAXIMUM
BODY WIDTH0.526 INCHES MAXIMUM
MAXIMUM POWER DISSIPATION RATING1.0 WATTS
STORAGE TEMP RANGE-65.0 TO +125.0 DEG CELSIUS
FEATURES PROVIDED HERMETICALLY SEALED AND W/ENABLE AND PROGRAMMABLE AND ERASABLE AND HIGH SPEED AND 3-STATE OUTPUT